RRAM News - Page 1

Israel-based RRAM developer Weebit Nano announced that it is in "advanced discussions" with a Tier-2 company to adapt Weebit's technology to meet the customer's unique memory module requirements.

Weebit Nano also announced that it has signed an agreement with Kitec Design that will be Weebit's representative in South Korea, Weebit's most important market (as Korea produces 57% of the global memory chip supply). Weebit is already engaging with several potential customers in Korea, including the Tier-2 company.

Strategic Elements announced that it has achieved significant technical improvements in its Nanocube Memory Ink technology at the University of New South wales (UNSW). The company is now incorporating these advancements into a transparent demonstrator that will be ready by Q3 2019.

SER says that it has developed new fabrication methods for its memory ink and its production onto plastics. SER has filed patents for these methods.

Applied Materials unveiled new high-volume manufacturing solutions for next-generation memories - Including MRAM, PCRAM and RRAM. The Endura platform integrates multiple materials engineering technologies along with on-board metrology to create new films and structures.

Applied’s Endura Impulse PVD platform for PCRAM and ReRAM production includes up to nine process chambers integrated under vacuum along with on-board metrology to allow the precise deposition and control of the multi-component materials for these emerging memories.

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Israel-based RRAM developer Weebit Nano announced that its partner Leti has perform retention and endurance tests on its SiOx RRAM technology - and found it to be "at the forefront of the market".
Weebit says that its RRAM demonstrated retention of over 10 years at 130-150 degrees (these high temperatures could enable its RRAM to target the demanding automotive market). Leti also found that a single SiOx RRAM cell endured a million cycles

A new AI consortium was announced that aims to deliver a vastly accelerated, power-saving AI platform and standard that enables new AI-rich capability for edge computing, gateways, cloud and data centers. The idea is to combine advanced acceleration hardware, resistive memory (RRAM) and optimized neural networks to create "ready-made, power-efficient solutions with unsupervised learning and event recognition capability".

The SCAiLE (SCalable AI for Learning at the Edge) consortium is already working with Japanese authorities to review opportunities for the 2020 Olympics, including video-based event detection and response capability. The consortium members include RRAM developer Crossbar and AI accelerator startup Gyrfalcon Technology, which recently announced the commercial availability of its LightSpeeur 2802M AI ASIC that include TSMC's eMRAM memory.

Israel-based SiOx RRAM developer Weebit Nano has signed an agreement to collaborate with the Technion Institute in Israel. Weebit will work together with a team of researchers to examine the possible use of ReRAM devices in processing-in-memory that could speed up processing, memory transfer rate and memory bandwidth and decrease processing latency – while using less power.

Weebit and the Technion will also perform characterisation and implementation of logic operations using Weebit’s RRAM test chips, demonstrating basic logic operations on a RRAM array