Researchers from Kyushu University and the National Taiwan Normal University developed a new RRAM device, readable through both electrical and optical methods. The device is based on perovskite quantum dots that enable to simultaneously store and visually transmit data.
RRAM News - Page 1
The project NEUROTEC (â€œNeuro-inspired artificial intelligence technologies for the electronics of the futureâ€) was launched in November 2019 to develop innovative "Beyond von Neumann" concepts for highly energy-efficient devices. The two-year project shows the great potential of a future neuromorphic computer.
The project aims to fuse two major technologies - machine learning and artificial neural networks (ANNs) and memristive materials and devices - especially redox-based RRAM and phase change memories (PCM). The project's mandate is to develop a full-range of basic technologies ranging from dedicated material deposition technologies, integration technologies, measurement technologies, the development of simulation and modelling tools, up to the design and realization of novel AI circuits.
Israel-based RRAM developer Weebit Nano announced that it completed the design and the tape-out of its first embedded RRAM module. This integrated test-chip will be used as the final platform for testing and qualification, ahead of customer production.
Weebit says that it has used its patent-pending analog and digital smart circuitry to significantly enhance the array's technical parameters, including speed, retention and endurance. The test chip comprises a full sub-system in which the module is embedded, enabling potential customers to use it as a development and prototyping platform for new products such as low-energy IoT devices.
Israel-based RRAM developer Weebit Nano announced that it has developed the world's first commercial integration of an oxide-based ReRAM (OxRAM) cell with an ovonic threshold switching (OTS) selector. Weebit says that this is a critical step in the company's commercialization path for the discrete (standalone) memory market (which they hope to achieve by 2024).
IC designer sureCore announced an agreement with UK-based RRAM developer Intrinsic to bring high-performance embedded RRAM to market. The two companies will deliver commercial memory solutions using sureCoreâ€™s patented memory architectures and Intrinsicâ€™s novel RRAM cell.
Using a combination of Intrinsicâ€™s CMOS compatible technology and sureCoreâ€™s high-performance, low power memory architectures will enable an accelerated development process and delivery of this new embedded non-volatile memory to be realised.
UK-based RRAM developer Intrinsic Semiconductor Technologies (Intrinsic) announced it closed a $1.85 million seed funding round, led by investors UCL Technology Fund and IP Group plc. The company will use the funds to develop prototypes of its RRAM memory devices on 300 mm silicon wafers in collaboration with imec.
Intrinsic was spun-off from the University College London (UCL) in 2017. The UCL Technology Fund is now supporting this next stage in the company's life.
Israel-based RRAM developer Weebit Nano announced it has raised $12 million AUD in its recent placement. The company says that its new funds will enable it to accelerate its commercialisation initiatives, including strengthening its technology, engineering and sales teams and increasing marketing activities in the embedded memory market. A non-underwritten share purchase plan to raise up to $3 million will be offered to eligible shareholders on the same terms as the Placement.
Weebit says it remains on track to achieve its first commercial agreement by mid-2021. Weebit Nano will also be able to accelerate the next phase of standalone memory development across both the technical and commercial aspects to fast track deployment, whilst also developing the next generation of its neuromorphic demo.
TSMC is developing RRAM technologies for several years, and the company first hoped to introduce its first embedded RRAM in 2019. This did not happen, but the company says it is now on track for first customer tape-outs in the second half of 2020.
TSMC will offer RRAM on its 40nm and 22nm manufacturing processes.