Australia-based RRAM developer dorsaVi announced that it has commenced physical manufacturing of its first RRAM-CMOS validation chip. The company's manufacturing data package has passed foundry intake, the wafer lot has been committed to fabrication, and processing is now underway on the front-end CMOS base.
The chip began its tape-out process in July 2026, and the current run will produce the transistor and circuit-level structures needed to support the RRAM memory array, the peripheral circuits and various evaluation features - before the RRAM-specific layers are added. Once the CMOS base is complete, the wafers will move on to partner-led back-end-of-line processing and RRAM stack integration, followed by electrical testing and characterisation.
dorsaVi is using a staged manufacturing approach, so that each step provides process learning and progress can be assessed before moving on to the next stage. The current chip is built on a 180nm process, and the company says the silicon-level learning it generates is intended to inform and de-risk its broader 22nm RRAM program, which it is developing together with researchers at ITRI in Taiwan and NTU in Singapore.
