4DS Memory announced that it has decided to take a strategic three-month pause to decide its future direction after an extensive analysis of its Sixth Platform Lot memory technology.
4DS also said that it will disengage from active collaborations with imec and Infineon Technologies. Following these decisions, 4DS announced that CTO Dr Ting Yen and chief strategy officer Peter Himes had tendered their resignations.
In December 2024, 4DS signed up Infineon to develop an RRAM memory test chip. In 2020, 4DS announced that it has raised a total of $5.45 million in two financing round. In 2017, 4DS signed signed an agreement with Belgium-based imec to develop a transferable manufacturing process for its technology. The 4DS memory cell is constructed using an advanced perovskite material, which has the same crystal structure as the inorganic compound calcium titanium oxide. The cells have no filaments and are so claim to be easier to scale compared to filamentary RRAM.